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Your search returned 34 records. Click on the hyperlinks to view further details of Titles.. |
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Magazine Name : Ieee Transactions On Components Hybrids And Manufacturing Technology
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Year : 1990 Volume number : 13 Issue: 02 |
Package Thermal Resistance: Geometrical Effects In Conventional And Hybrid Packages
(Article)
Subject:
Thermal Resistance
,
Geometrical Analysis
,
Conventional
,
Hybrid
Author:
William E.
Pence
J. Peter
Krusius
page:
245
-
251
Building The Bridge Between Design And Manufacturing
(Article)
Subject:
Building
,
Bridge
,
Design
,
Manufacturing Design
Author:
Manuel
Correia
William J.
Preman, Iii
page:
252
-
257
A Closed Form Analytical Model For The Electrical Properties Of Microstrip Interconnects
(Article)
Subject:
Analytical Model
,
Electrical Properties
,
Microstrip
,
Interconnects
Author:
Eric
Bogatin
page:
258
-
266
Intermetallic Formation On The Fracture Of Sn/Pb Solder And Pd/Ag Conductor Interfaces
(Article)
Subject:
Intermetallic
,
Formation
,
Degradation
,
Substrate
Author:
Bi-Shiou
Chiou
K. C
Liu
Jenq-Gong
Duh
page:
267
-
274
A Novel Lossy And Dispersive Interconnect Model For Integrated Circuit Simulation
(Article)
Subject:
Novel
,
Interconnect Model
,
Lossy And Dispersive
,
Integrated Circuit Interconnections
Author:
William R.
Eisenstadt
Jiann-Shiun
Yuan
Juin J
Liou
page:
275
-
280
A Novel Method Of Metallization For Mmic'S
(Article)
Subject:
Novel
,
Metallization
,
Mmic
Author:
S.
Mahapatra
Debabani
Choudhury
page:
281
-
283
Formation Of Voids In Silicone Rtv Dispersion Under Beam-Leaded Silicon Integrated Circuits
(Article)
Subject:
Formation Of Voids
,
Silicone Rtv Dispersion
,
Beam-Leaded
,
Silicon Integrated Circuits
Author:
Donald
Jaffe
Jerzy A.
Owczarek
Frank L.
Howland
page:
284
-
293
Simulation And Design Of Lossy Transmission Lines In A Thin-Film Multichip Package
(Article)
Subject:
Simulation
,
Transmission Lines
,
Thin Film
,
Multichip Package
Author:
Lih-Tyng
Hwang
Lwona
Turlik
page:
294
-
302
1/F Noise In Ceramic Superconductors And Granular Resistors
(Article)
Subject:
Noise
,
Ceramics
,
Superconductor
,
Granular Resistors
Author:
Keiji
Takagi
Toru
Mizunami
Hideyuki
Okayama
page:
303
-
305
Ag-Pd Thick Film Conductor For Ain Ceramics
(Article)
Subject:
Thick Film
,
Ain
,
Ain Ceramics
,
Ag-Pd
Author:
Tsuneo
Endoh
Kazuji
Yamada
Shigeru
Takahashi
Yasutoshi
Kurihara
page:
306
-
312
High Thermal Conductivity Aluminum Nitride Ceramic Substrates And Packages
(Article)
Subject:
Thermal Conductivity
,
Aluminum Nitride
,
Ceramic Substrates
,
Ceramic Packages
Author:
Nobuo
Iwase
Akihiko
Tsuge
page:
313
-
319
Contact Pressure And Current Density Distribution In A Circular Contact Surface
(Article)
Subject:
Contact Pressure
,
Current Density Distributions
,
Circular Contact Surface
Author:
Soo-Woong
Park
Suck-Joo
Na
page:
320
-
325
A Study On Hybrid Modeling Of Electrical Phenomena In Contacts
(Article)
Subject:
Hybrid Models
,
Electrical Contact
,
Electrical Phenomena In Contacts
Author:
Soo-Woong
Park
Suck-Joo
Na
page:
326
-
330
Automatic Defect Classification Of Printed Wiring Board Solder Joints
(Article)
Subject:
Classification
,
Wiring
,
Solder Joint Reliability
,
Automatic Defect
Author:
Morris R.
Driels
Daniel J.
Nolan
page:
331
-
340
Full Wave Three-Dimensional Simulation Of Maxwell'S Equations For The Electrical Characterization Of High-Speed Interconnects
(Article)
Subject:
Full-Wave Rectifier
,
Three-Dimensional Simulation
,
Maxwell'S Equations
,
Electrical Characterization
Author:
R. Wayne
Johnson
Fred J.
German
page:
341
-
346
Benzocyclobutene Interlayer Dielectrics For Thin Film Multichip Modules
(Article)
Subject:
Interlayer
,
Dielectrics
,
Thin Film
,
Multichip Modules
Author:
R. Wayne
Johnson
Timothy L.
Phillips
page:
347
-
352
The Tribological Properties Of N2+ Implanted Au Ag Cu Alloy And Palladium In Sliding Contact With Gold Electroplate
(Article)
Subject:
Tribological Properties
,
Palladium
,
Sliding Contact With Gold Electroplate
,
Implanted Au Ag Cu Alloy
Author:
Patrick W.
Leech
page:
353
-
357
A Study Of The Off-Contact Screen Printing Process. Part I: Model Of The Printing Process And Some Results Derived From Experiments
(Article)
Subject:
Screen Printing
,
Experiments
,
Results Derived
,
Off-Contact
Author:
Jerzy A.
Owczarek
Frank L.
Howland
page:
358
-
367
A Study Of The Off-Contact Screen Printing Process-Part Ii:. Analysis Of The Model Of The Printing Process
(Article)
Subject:
Off-Contact
,
Screen Printing
,
Analysis Of Printed
,
Printing Process
Author:
Jerzy A.
Owczarek
Frank L.
Howland
page:
368
-
375
Parallel-Gap Welding To Very-Thin Metallization For High Temperature Microelectronic Interconnects
(Article)
Subject:
Metallization
,
High Temperature
,
Microelectronics
,
Interconnects
Author:
John J.
Fendrock
Lazaro M.
Hong
page:
376
-
382
A Model For Moisture Induced Corrosion Failures In Microelectronic Packages
(Article)
Subject:
Moisture Induced
,
Corrosion Failures
,
Microelectronic Packages
,
Metallization
Author:
Michael
Pecht
page:
383
-
389
Multilayer Ceramic Packaging Alternatives
(Article)
Subject:
Multilayer Cermic Capacitor
,
Ceramic Packages
,
Alternatives
,
Ceramics
Author:
John L.
Sprague
page:
390
-
396
The Inverted T-Joint For Surface Mount Connectors
(Article)
Subject:
Inverter
,
T-Joint Configuration
,
Surface Mount Technology
,
Connectors
Author:
Toshinori
Watanabe
Shoji E.
Yamada
page:
397
-
400
New Developed Of Thin Plastic Package With High Terminal Counts
(Article)
Subject:
Thin Plastic Package
,
High Terminal Counts
,
High-Temperature
,
Tab
Author:
Shin-Ichi
Nakao
M
Yasunaga
H
Shimamoto
page:
401
-
406
Reflections From Bends In A Printed Conductor
(Article)
Subject:
Reflection
,
Bends
,
Printed Conductor
,
Electrical Interconnections
Author:
A. J.
Rainal
page:
407
-
413
Properties Of Cutesefe Contact Material For Vacuum Interruptors
(Article)
Subject:
Contact Material
,
Properties Of Cu Te Se Fe
,
Vacuum Interruptors
,
Iron
Author:
Jimei
Wang
Xiaotian
Wang
Bingjun
Ding
page:
414
-
416
Capacitance Of A Strip Capacitor
(Article)
Subject:
Capacitance
,
Stripping
,
Capacitors
,
Bem
Author:
M.
Nakamura
Hitoshi
Nishiyama
page:
417
-
423
Constitutive Relation And Creep-Fatigue Life Model For Eutectic Tin-Lead Solder
(Article)
Subject:
Constitutive Relation
,
Creep Fatigue Failure.
,
Eutectic
,
Tin-Lead Solder
Author:
L.R.
Fox
Sheera
Knecht
page:
424
-
433
Analysis Of The Dynamic Phenomena During Lamination Of Multilayer Printed Circuit Board By The Measurement Of Pressure Distribution
(Article)
Subject:
Dynamic
,
Lamination
,
Multilayer
,
Printed Circuit Board
Author:
K
Yamauchi
Yotaro
Hatamura
page:
435
-
439
A Pillar-Shaped Via Structure In A Cu-Polyimide Multilayer Substrate
(Article)
Subject:
Structure
,
Multilayer
,
Substrate
,
Pillar-Shaped
Author:
Satoru
Yamaguchi
Noboru
Iwasaki
page:
440
-
443
A New Face Down Bonding Technique Using A Low Melting Point Metal
(Article)
Subject:
Liquid Crystal Displays
,
Lcd Driver
,
Low Melting
,
Point Metal
Author:
Masayuki
Saito
Miki
Mori
Akinori
Hongu
page:
444
-
447
Low Dielectric Constant New Materials For Multilayer Ceramic Substrate
(Article)
Subject:
Flexural Strength
,
Lamination
,
Dielectric Constant
,
Multilayer Cermic Capacitor
Author:
Hideo
Takamizawa
Yuzo
Shimada
Keiichiro
Kata
page:
448
-
451
Characteristics Of Press-Soldered Joints By Using Resistance Heating
(Article)
Subject:
High-Temperature
,
Characteristics
,
Resistance
,
Heating
Author:
Takashi
Haramaki
Takao
Funamoto
Tomohiko
Shida
page:
452
-
456
Titanium Nitride-Molybdenum Metallizing Method For Aluminum Nitride
(Article)
Subject:
Titanium Nitride Coating
,
Aluminum Nitride
,
Nitride-Molybdenum
,
Metallizing Method
Author:
H
Asai
Nobuo
Iwase
H
Sato
K
Kimura
page:
457
-
461
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